NEPTCO, Inc. has developed and manufactured custom-engineered laminated and coated materials for nearly half a century. Our NEPTCO WAFERTAPE™ products for wafer mounting, dicing and backgrinding are designed to insure consistent, precise, and repeatable wafer yields.

Commercial & Developmental Products

· Pressure sensitive adhesive on expandable base film
· Pressure sensitive adhesive on non-expandable base film
· UV curable PSA adhesive on expandable base film
· UV curable PSA adhesive on non-expandable base film
· Dicing tape for hard materials & optoelectronic components
· Backgrinding tape for bumped wafers
· Backgrind removal tape (detaping tape)

Technical support

Our lab facilities contain the latest equipment for chemical and mechanical evaluation of adhesives and coated films, as well as a high speed dicing saw and UV exposure unit. Our scientists use this equipment to simulate our customers' production environments and often work directly with their engineering staff to help streamline the dicing process.

Customer Service

· NEPTCO is the only U.S. manufacturer of dicing tapes, and we sell
  directly to the end-user.
· Small quantities and special orders are welcome.
· Hand samples are available.

For more information on dicing, backgrinding, or backgrinding removal tapes, contact Tom Auger at: 401-722-5500, e-mail: TAuger@neptco.com, or click on this button to go to NEPTCO's Web Site:


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