350 employees in seven locations create LTCC packages with a unique patented material mixture of glass and ceramics for RF, wireless and other applications. This breakthrough technology results in warpage of 50 microns over 50 mm² versus conventional suppliers' 200 microns. In addition, Hirai holds shrinkage to ±0.05% versus the present industry standard of ±0.8%. These parameters have allowed customers to eliminate new setups for each panel processed. Yields can be 100 % plus the bonus of NO REWORK! Embeded passive components (inductors, capacitors, resistors) can be formed inside the milti-layered LTCC panels. After sintering, "anorthite" is formed which provides additional mechanical strength.

In addition to LTCC, Hirai is the largest etching company in Japan. They specialize in BGA heatspreaders/stiffeners and leadframes.

REPRESENTATIVE PRODUCTS USING LTCC

* MEMS, WIRELESS, BLUETOOTH AND BROADBAND DEVICE PACKAGING
-up to 100 layer packages with imbedded components

* SUPER COMPUTER
-High Speed Computer Package with Multilayer Glass-Ceramic Substrate

* OPTICAL INTERFACE
-Multichip Module for 156Mb/s Optical Interface

* SATELLITE MICROWAVE COMMUNICATION SYSTEM
- Glass-Ceramic Multichip Module for Satellite Microwave Communication systems.

* 3 DIMENSIONAL MEMORY MODULE
- Flip Chip Bonding Reliability of Advanced Glass Ceramic Chip Size Package

* LOW COST 60 GHz-BAND ANTENNA-INTEGRATED TRANSMITTER/RECEIVER
- Low cost Multi-Layer Ceramic Package for Flip-Chip MMIC up to W-Band.

Follow these links for more information on Hirai and its products. Outline and History Customers and Sales History Products and Production Flow Certifications Hirai's Web Site Sales Offices

Amkor LTCC in Adobe Acrobat format (*.pdf).